Speaker Bio
Graduated from Tsinghua University with a master's degree in Integrated Circuits and over ten years of IC marketing experience.
John has participated in national-level projects of Core Electronic Devices and the NRDC Financial Project, and has obtained multiple national invention patents. John and his team have achieved various international authoritative certifications including CC EAL6+ security certification and GSMA SAS-UP wafer-level personalization, which are the first in China. He is committed to promoting the global application of Chinese security chips in fields such as communication, finance, and automotive electronics. Under his leadership, TMC has established a strong presence in the global SIM card market and was proved to be the first Chinese chip designer to commercialize the eSIM solution globally.